FA Products

Semiconductor Failure Analysis Products

RKD Engineering’s extensive line of sample preparation products allow the Failure Analysis engineer to open plastic packages exposing the die surface and bond wires, thin die for optical back side evaluation and FIB editing, and perform front side de-layering.

Mechanical and chemical decapsulation

The Elite Etch is an acid decapsulator built with 21st Century design concepts. Design innovations have produced the Elite Etch, a tool that encompasses all the functionalities required for sample decapsulation of plastic IC packages with reproducable high throughput package decapsulation, coupled with low acid consumption.

Documented field trails confirm Elite Etch consistently outperforms all other commercially available acid decapsulators. Elite Etch process times are always shorter than with other decapsulators, saving both time and money - a key benefit for definitive rapid package evaluation in business sectors including Counterfeit Protection Measures.

The MicroMill is designed to make gaskets and other fixtures for use with RKD Engineering, Nisene and NSC decapsulators. It can also perform mechanical decapsulation and heat spreader removal in preparation for acid decapsulation. It provides an easy to use solution for quick turn decapsulator tooling and device preparation. The MicroMill has a simple, easy to use operator interface making all if its jobs fast and easy to set up and easier to run.