Elite Etch Cu 7100
The Elite Etch Cu from RKD Engineering is an automated mixed acid decapsulator which enables high productivity through the integration of advanced features. This decapsulator rapidly opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or mixed acids to the sample package.
This model incorporates an advanced heating and cooling system which prevents metal damage in integrated circuits containing copper.
The first acid decapsulator made for copper
The Elite Etch Cu 7100 improves upon the design of the Elite Etch 7000 by incorporating a rapid heating and cooling system. Using a thermal exchanger directly contacting the etch head and acid lines, sulfuric acid decapsulation rate is accelerated to reduce overall volume usage. A precise acid temperature combined with a high delivery rate allows decapsulation of copper wired devices without causing damage to the metallized wires. The specially designed acid heat exchanger can accurately control the acid temperature between 10° and 250° C with flow rates of up to 8 ml per minute. The high acid pulse rates allow for reasonable etch times even at the lowest temperatures.
The Elite Etch Cu features an acid controller etch head which is machined from premium grade silicon carbide for unsurpassed acid resistance. The etch head is designed to reduce the fuming of any residual acids left on the etch head at the end of the process, both for operator safety and convenient acid disposal.
The device hold-down assembly (ram nose) is a pneumatically activated push rod. The ram nose is normally retracted and extends when the safety cover is fully closed. The ram nose secures the sample package and a definition gasket to the etch head, thus eliminating movement of either the package or its fixturing.
RKD Engineering incorporates double containment for all fluid couplings between the bottle container and the decapsulator. The bottle box assembly and the etcher unit both contain fluid sensors to alert the operator in the event of an acid leak from any of the bottles or internal fittings. The bottle box incorporates a universal pivoting interconnect which allows simple bottle exchange with minimal exposure to residual acid.
|Etcher Unit||Height: 300 mm (13 in)|
|Width: 190 mm (7.5 in)|
|Depth: 305 mm (12 in)|
|Bottle Assembly||Height: 254 mm (10 in)|
|Width: 280 mm (11 in)|
|Depth: 127 mm (5 in)|
|Weight||Approx. 16 kg (35 lb)|
|Power Source||90 to 250 VAC, 50 to 60 Hz (4 amp)|
|Acid temp. range||10° to 250° C|
|Acid temp. set point||1° C ± 1% of setting|
|Etch cavity (up to)||22 mm x 22 mm (30 mm diagonal)|
|Choice of Acids||fuming nitric acids, mixed fuming nitric and sulfuric acids, or fuming/concentrated sulfuric acid|
|Acid Mix Ratios||(nitric to sulfuric ratios) 9:1, 6:1, 5:1, 4:1, 7:2, 3:1, 5:2, 2:1, 3:2, 1:1, 1:2, 1:3, 1:4, 1:5|
|Post Etch Rinse Options||sulfuric acids, fuming nitric acids, mixed acids, or no rinse|
|Etch Times||1 to 2,400 seconds in 1 second increments (1 seconds to 40 minutes) dynamic (real time) adjustments of etch time|
|Etchant Volume Selection||1 to 8 ml per minute - for all acids & acid mixes|
|Etch Delivery Functions||pulsed or Reciprocal Etch Acid Pulse (REAP) for lower acid consumption|
|Operator Program Storage||100 programs stored to nonvolatile memory|
|Warranty||most comprehensive and inclusive warranty in industry (ask for full details)|
|Elite Etch 7000||Elite Etch Cu 7100||Elite Etch Cu ESD 7200||Mega Etch 7300|
|Dual Acid Decapsulation|
|Dual Acid Decapsulation||✔||✔||✔||✔|
|Mix Ratios Settings|
|Mix Ratios Settings||✔||✔||✔||✔|
|Bottle Box Included|
|Bottle Box Included||✔||✔||✔||✔|
|Rapid Cooling System|
|Rapid Cooling System||✔||✔||✔|
|ESD Mitigation Control|
|ESD Control Included||✔||✔|
|Direct Board Decapsulation|
|Direct Large Board Decapsulation||✔|