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Failure Analysis Equipment and Beyond

Elite Etch Cu 7100

The Elite Etch Cu from RKD Engineering is an automated mixed acid decapsulator which enables high productivity through the integration of advanced features. This decapsulator rapidly opens even the most delicate packages by delivering precise, micro-aliquots of nitric, sulfuric, or mixed acids to the sample package.

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The first acid decapsulator made for copper

The Elite Etch Cu 7100 improves upon the design of the Elite Etch 7000 by incorporating a rapid heating and cooling system. Using a thermal exchanger directly contacting the etch head and acid lines, sulfuric acid decapsulation rate is accelerated to reduce overall volume usage. A precise acid temperature combined with a high delivery rate allows decapsulation of copper wired devices with no wire or metallization damage. The specially designed acid heat exchanger can accurately control the acid temperature between 10° and 250° C with flow rates of up to 8 ml per minute. The high acid pulse rates allow for reasonable etch times even at the lowest temperatures.

The Elite Etch Cu features an acid controller etch head which is machined from premium grade silicon carbide for unsurpassed acid resistance. The etch head is designed to reduce the fuming of any residual acids left on the etch head at the end of the process, both for operator safety and convenient acid disposal.

The device hold-down assembly (ram nose) is a pneumatically activated push rod. The ram nose is normally retracted and extends when the safety cover is fully closed. The ram nose secures the sample package and a definition gasket to the etch head, thus eliminating movement of either the package or its fixturing.

RKD Engineering incorporates double containment for all fluid couplings between the bottle container and the decapsulator. The bottle box assembly and the etcher unit both contain fluid sensors to alert the operator in the event of an acid leak from any of the bottles or internal fittings. The bottle box incorporates a universal pivoting interconnect which allows simple bottle exchange with minimal exposure to residual acid.


Specifications

Etcher Unit Height: 300 mm (13 in)
Width: 190 mm (7.5 in)
Depth: 305 mm (12 in)
Bottle Assembly Height: 254 mm (10 in)
Width: 280 mm (11 in)
Depth: 127 mm (5 in)
Weight Approx. 16 kg (35 lb)
Power Source 90 to 250 VAC, 50 to 60 Hz (4 amp)
Acid temp. range 10° to 250° C
Acid temp. set point 1° C ± 1% of setting
Etch cavity (up to) 22 mm x 22 mm (30 mm diagonal)
Choice of Acids fuming nitric acids, mixed fuming nitric and sulfuric acids, or fuming/concentrated sulfuric acid
Acid Mix Ratios (nitric to sulfuric ratios) 9:1, 6:1, 5:1, 4:1, 7:2, 3:1, 5:2, 2:1, 3:2, 1:1, 1:2, 1:3, 1:4, 1:5
Post Etch Rinse Options sulfuric acids, fuming nitric acids, mixed acids, or no rinse
Etch Times 1 to 2,400 seconds in 1 second increments (1 seconds to 40 minutes) dynamic (real time) adjustments of etch time
Etchant Volume Selection 1 to 8 ml per minute - for all acids & acid mixes
Etch Delivery Functions pulsed or Reciprocal Etch Acid Pulse (REAP) for lower acid consumption
Operator Program Storage 100 programs stored to nonvolatile memory
Warranty most comprehensive and inclusive warranty in industry (ask for full details)

Downloads

Brochure
Spec Sheet
Basic Model Recommended
Elite Etch 7000 Elite Etch Cu 7100 Elite Etch Cu ESD 7200 Mega Etch 7300
Dual Acid Decapsulation
Dual Acid Decapsulation
  Mix Ratios Settings
Mix Ratios Settings
  Touchscreen Interface
Touchscreen Interface
  Bottle Box Included
Bottle Box Included
  Silicon Protective
Silicon Protective
  Aluminum Protective
Aluminum Protective
  Gold Protective
Gold Protective
  Rapid Cooling System
Rapid Cooling System
  Copper Protective
Copper Protective
  Silver Compatability
Silver Compatability
  ESD Mitigation Control
ESD Control Included
  Direct Board Decapsulation
Direct Large Board Decapsulation