The solution to silver wire decapsulation
An accessory product designed to augment the Elite Etch series for metal wire preservation.
This solution is designed to create a more effective etching process and to prevent metal loss with samples that have silver alloy wires.
PCB semiconductor decapsulator
The Mega Etch 7300 was designed with the PCB manufacturer in mind.
This system gives an engineer the ability to open IC packages which are still attached to the original printed circuit board.
ESD safe decapsulation
Decapsulation of gold, copper, and aluminum ICs with metal wire protection.
This ESD model prevents dangerous static discharge which could potentially damage circuits in an IC package.
Copper safe acid decapsulation
The Elite Etch Cu is an automated mixed acid decapsulator used to expose chips in ICs.
This model incorporates an advanced heating and cooling system which prevents metal damage in integrated circuits containing copper.
Dual acid decapsulation
RKD Engineering's first generation automated mixed acid decapsulator.
A precise acid temperature combined with a high delivery rate allows decapsulation without the risk of bond wire damage.
Gaskets and more
Designed to mechanically remove encapsulant materials and cut custom gaskets.
The Elite Etch series functions ideally with a correctly sized gasket, making the Nano Mill II a common accessory unit.
Mounting IC packages for sample preparation
Specially designed hot plate used for wax mounting of integrated circuit packages.
Precise fluid delivery
Custom milled gaskets to hold the IC package in place for contolled etchant delivery.
Solutions for any sample
Accessory kits give you more control over the precision of your sample preparation.