Before and after. 7mm diameter semiconductor.
On board semiconductor decapsulation using Mega Etch 7300.
High precision etch using Elite Etch Cu 7100.
Copper wire exposure using a high concentration sulfuric acid composition.
Dime for scale of small decapsulation operation.
Silver wire package exposure using I53 injector system.
Wire bond to the surface pad exposed with zero damage to the circuitry.
Exposing a very small silicon chip in a package
Multiple silicon chips in the same package with connecting wires.
Complex circuitry perfectly preserved such that the device still functions normally.
Silver bond wires exposed in an SMD package.
Tight tolerance operation leaving the edge of the package intact.